HF High 150 TG FR4 Material With 3 mm Blind Buried Hole Via
Products Details
We are the highest efficience pcb manufature here .
(1) Professional Manufacturer on PCB for about 10 years
(2) More than 500 workers, over 4,000 square meters for day-output and 1,000,000 square meters for year-output.
(3) Plant passed passed ISO/TS16949: 2000 and ISO14001: 2004
and products meet IPC-A-600F, IPC-D-600G, MIL-STD-105D LEVEL II, UL and SGS Certification
OME Manufature
a. We manufacture PCB,PCBA,Singe/Double side PCB, Multilayer PCB,Aluminium PCB,Spray Tin PCB,Immersed Gold PCB,HDI Mobilephone PCB,Gold-plating PCB,(printed circuit board with assembly) PCBA,SMT PCBA,DIP PCBA,PCB&PCBA Copy,PCB Assembly,OSP,HASL,etc.
b. Expert circuit board testing, high quality factory wholesale price
c. PCB OEM&ODM Clone/Copy, conform to UL,SGS,RoHS
We offer our customers a wide range material and boards:
1. Single-sided, double-side, multi-layer PCB & Aluminium LED PCB
2. HASL, HAL lead free, OSP, Immersion Gold/ Silver/ Tin surface finish available
3. Base Materials: FR4, High TG FR4,CEM-1, CEM3, Aluminum(metal core)
4. Aluminum PCB board thickness from 0.8mm-3.6mm
5. Quantity from prototype to volume production
6. Fast turnaround time, prompt delivery, high quality at competitive price Detailed Specification of PCB Manufacturing
PrePreg Material
| Parameter |
Standard Spec (mm) |
| Layer |
4 L |
| DHI stack |
3 |
| Board thinckness |
3.0 |
| Max work panel size |
530×610 |
| Aspect ratio |
12:1 |
| L/S |
0.07/0.07 |
| Surfce finish |
OPS,ENIG,Hard gold |
| Material |
FR-4 |
| Inner packaging |
Vacuum |
| Solder masker |
Green/ Black/ Red/ Yellow/ White/Blue |
| Outgoing reports |
Final inspection,solderability test,micro section test ,thermal stresses test and more |
| Performance characteristics |
| Glass Transition Temperature (Tg) |
150Tg or 170Tg |
| Decomposition Temperature (Td) |
> 325℃ |
| Coefficient of Thermal Expansion (CTE) |
3.0%-3.8% |
| Dielectric Constant (@1 GHz) |
4.25-4.55 |
| Dielectric Constant (@55 GHz) |
≤5.5 |
| Dissipation Factor (@ 1 GHz) |
0.016 |
| Water imbibition (D - 24/23, the thickness of 1.6 mm) |
≤19mg |
| Laminate thickness |
0.005”~ 0.125” |
| Combustibility |
FV0 |
| Density |
1.70-1.90g／cm³ |
| Vertical Layer To The Bending Strength A |
Normal :E-1／150,150±5℃≥340Mpa |
| Parallel To The Floor To The Impact Strength (beam) |
≥233KJ／m |
| Execution Standard |
GB/T1303.1-1998 |
| After Flooding Insulation Resistance |
D-24／23):≥5.0×108Ω |
| Vertical layer to the electric strength (in the middle of 90 + 2 ℃ for transformer oil, thickness 1 mm) |
≥14.2MV／m |
| Parallel layer to the breakdown voltage (90 + 2 ℃ in the transformer oil) |
≥40KV |
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Product Tags:
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HF High 150 TG FR4 Material circuit board fabrication With 3 mm Blind Buried Hole Via Images
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