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4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication

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Shenzhen Xinchenger Electronic Co.,Ltd

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4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication

Brand Name : XCE

Model Number : XCEF

Certification : CE,ROHS, FCC,ISO9008

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Base material : ShengYi FR4

Name : multilayer pcb

Board thickness : 1.2mm

Copper THK : 1OZ

Board size : 10*9cm

Surface finish : HASL

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4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication 

Quick detail:

Surface: Lead free HASL	Layer number:4
Special technology:blind hole	Hole:PTH
Origin:China	Model:XCEF

Specification

PCB Type:	multilayer PCB
Layer :	4 layer
Min .Line Width/Space:	3mil/3mil
Min. Via Diameter:	0.3mm
Finish Thickness:	0.2mm
Surface Finish:	ENIG
Size:	10*9MM
Material:	fr4
Color:	blue
Application:	telecommunication

Parameter

Profile tolerance			±0.10mm(4mil)
Board bend&warp			≤0.7%
Insulation resistance			＞1012Ωnormal
Through-hole resistance			＜300Ωnormal
Electric strength			＞1.3kv/mm
Current breakdown			10A
Peel strength			1.4N/mm
Soldmask regidity			＞6H
Thermal stress			288℃20Sec
Testing voltage			50-300v
Min buried blind via			0.2mm(8mil)
Outer cooper thickness			1oz-5oz
Inner cooper thickness			1/2 oz-4oz
Aspect ratio			8:1
SMT min green oil width			0.08mm
Min green oil open window			0.05mm
Insulation layer thickness			0.075mm-5mm
Aperture			0.2mm-0.6mm
Special technology			Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish			HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

High frequency PCB Introduce:

Model	Parameter	thickness(mm)	Permittivity(ER)
F4B	F4B	0.38	2.2
	F4B	0.55	2.23
	F4B	0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0	2.65
	F4Bk	0.8,1.5	2.65
	F4B	0.8	3.5
	FE=F4BM	1	2.2
Rogers	RO5880	0.254 0.508 0.762	2.20 ± 0.02
	RO4350	0.254 0.508,0.8,1.524	3.5
	RO4003	0.508	3.38
TACONIC	TLF-35	0.8	3.5
	TLA-6	0.254,0.8,1,1.5,	2.65
	TLX-8	0.254,0.8,1,1.6	2.55
	RF-60A	0.64	6.15
	TLY-5	0.254,0.508,0.8	2.2
	TLC-32	0.8,1.5,3	3.2
	TLA-35	0.8	3.2
ARLON	AD255C06099C	1.5	2.55
	MCG0300CG	0.8	3.7
	AD0300C	0.8	3
	AD255C03099C	0.8	2.55
	AD255C04099C	1	2.55
	DLC220	1	2.2

Description:

A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown.
Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.

4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication

Product Tags:

circuit board fabrication

printed circuit board fabrication

4 Layer BGA Rigid FR4 PCB , Blind Hole Circuit Board Fabrication Images

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