Multilayer Fr4 PCB High TG With Gold Plating Surface Finish
Quick Detail :
1. Type : Pcb
2. Material : Fr4
3. Layer : Multilayer
4. Products Size :12*6cm
5. Permittivity : 3
6. Surface finish : Gold Plating
Features:
1. Rogers pcb multilayer pcb with high frequency can improvide the
products quality ,with high techolonogy treatment improve the life
cycle of the products .
2. Immersion gold surface finish make the pcb 's conductive
performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much
more better .
4. Low dielectric : 3 dielectric conductivity much more precision .
Description :
Most printed circuit boards are manufactured using glass-reinforced
epoxy laminate as the substrate. While there are a wide variety of
laminates available on the market, FR-4 is both versatile and
well-accepted as a standard material for PCB manufacture. FR-4
functions well as an electrical insulator, and has a good
strength-to-weight ratio, and is flame resistant.
The standard FR-4 material that is used in our PCBExpress® Quickturn, ValueProto® and the default material for our PCBpro® Full Feature products is a high temperature, high Td, low CTE 150Tg material.
If a higher Tg material is required, we do stock a 170Tg version of our standard FR-4 material as well, that can be
substituted in our PCBpro Full Feature and Custom Quote products
(provide a readme file or a print note specifying the 170 Tg material). There may be a material lead time for some specific
sizes or thickness, and may impact due date.
Key Benefits:
- High dielectric constant for circuit size reduction
- Low loss. Ideal for operating at X-band or below
- Tight εr and thickness control for repeatable circuit performance
Typical Applications:
- Space Saving Circuitry
- Patch Antennas
- Satellite Communications Systems
- Power Amplifiers
- Aircraft Collision Avoidance Systems
- Ground Radar Warning Systems
Production Description :
| Parameter | Value | | Specific gravity/density | 1.850 g/cm3 (3,118 lb/cu yd) | | Water absorption | −0.125 in < 0.10% | | Temperature index | 140 °C (284 °F) | | Thermal conductivity, through-plane | 0.29 W/(m·K),[1] 0.343 W/(m·K)[2] | | Thermal conductivity, in-plane | 0.81 W/(m·K),[1] 1.059 W/(m·K)[2] | | Rockwell hardness | 110 M scale | | Bond strength | > 1,000 kg (2,200 lb) | | Flexural strength (A; 0.125 in) - LW | > 440 MPa (64,000 psi) | | Flexural strength (A; 0.125 in) - CW | > 345 MPa (50,000 psi) | | Tensile strength (0.125 in) LW | > 310 MPa (45,000 psi) | | Izod impact strength - LW | > 54 J/m (10 ft·lb/in) | | Izod impact strength - CW | > 44 J/m (8 ft·lb/in) | | Compressive strength - flatwise | > 415 MPa (60,200 psi) | | Dielectric breakdown (A) | > 50 kV | | Dielectric breakdown (D48/50) | > 50 kV | | Dielectric strength | 20 MV/m | | Relative permittivity (A) | 4.8 | | Relative permittivity (D24/23) | 4.8 | | Dissipation factor (A) | 0.017 | | Dissipation factor (D24/23) | 0.018 | | Dielectric constant permittivity | 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz | | Glass transition temperature | Can vary, but is over 120 °C | | Young's modulus - LW | 3.5×106 psi (24 GPa) | | Young's modulus - CW | 3.0×106 psi (21 GPa) | | Coefficient of thermal expansion - x-axis | 1.4×10−5 K−1 | | Coefficient of thermal expansion - y-axis | 1.2×10−5 K−1 | | Coefficient of thermal expansion - z-axis | 7.0×10−5 K−1 | | Poisson's ratio - LW | 0.136 | | Poisson's ratio - CW | 0.118 | | LW sound speed | 3602 m/s | | SW sound speed | 3369 m/s |
|
|---|
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
