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High TG Multi Layer Copper Base PCB Circuit Boards Fabrication High Performance

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Shenzhen Xinchenger Electronic Co.,Ltd

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Min line space : 0.2mm

Min line width : 0.2mm

Copper thickness : 2OZ

Size : 11*2cm

Board THK : 1.0MM

Panel : 5*1

Surface finish : HAL Lead free

Color : green

Material : FR4 High TG

Model : XCEM

High TG Multilayer Copper Base PCB Circuit Boards Fabrication

Parameter:

PCB parameter
Max panel size			508*610mm
Board thickness tolerance			T≥0.8mm±8%,T＜0.8mm±5%
Wall hole copper thickness			＞0.025mm(1mil)
Finished hole			0.2mm-6.3mm
Min line width			4mil/4mil(0.1/0.1mm)
Min bonding pad space			0.1mm(4mil)
PTH aperture tolerance			±0.075mm(3mil)
NPTH aperture tolerance			±0.05mm(2mil)
Hole site deviation			±0.05mm(2mil)
Profile tolerance			±0.10mm(4mil)
Board bend&warp			≤0.7%
Insulation resistance			＞1012Ωnormal
Through-hole resistance			＜300Ωnormal
Electric strength			＞1.3kv/mm
Current breakdown			10A
Peel strength			1.4N/mm
Soldmask regidity			＞6H
Thermal stress			288℃20Sec
Testing voltage			50-300v
Min buried blind via			0.2mm(8mil)
Outer cooper thickness			1oz-5oz
Inner cooper thickness			1/2 oz-4oz
Aspect ratio			8:1
SMT min green oil width			0.08mm
Min green oil open window			0.05mm
Insulation layer thickness			0.075mm-5mm
Aperture			0.2mm-0.6mm
Special technology			Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish			HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

Product Tags:

multi layered pcb

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