Sign In | Join Free | My
China Shenzhen Xinchenger Electronic Co.,Ltd logo
Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
Site Member

8 Years

Home > Fr4 PCB >

Prototype Laser Drill pcb double sided In Calculator Application , HASL - LF Surface

Shenzhen Xinchenger Electronic Co.,Ltd

Prototype Laser Drill pcb double sided In Calculator Application , HASL - LF Surface

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : FR4

Layer : 2

Color : Green

Min line space : 5mil

Min line width : 5mil

Copper thickness : 1OZ

Board size : 99*82mm

Panel : 1

Surface : HASL-LF

Contact Now

Prototype Laser Drill pcb double sided In Calculator Application , HASL - LF Surface

Quick detail:

Origin:ChinaSpecial: FR4 Material
Surface: HASL-LFHole:0.5

Double-Side Prototype Laser Drill PCB In Calculator Application In Green Soldermask HASL-LF Surface

Model Number:XCEPCB003

Shipping port:ShenZhen/HongKong

Place of origin:GuangDong,China

Delivery Time:3-10 Working Days

Production capacity:FR4:2000000Sqms High Frequency board:10000Sqms

Price Terms:FOB

Minimum Order Quantity:1pc

Payment terms:TT,Paypal,Western Union


Liquid photo solder resist (commonly known as green oil) is a protective layer coated on the printed circuit board without welding line and the substrate, or as a solder resist. Aim is long-term protection circuit patterns formed.
Liquid photoimageable solder resist ink main ingredients include: epoxy and acrylic resins having a photosensitive properties, such as Bisphenol epoxy resin, phenol resin, phenol epoxy resin and amine methyl and ethyl; photoinitiator such as thioxanthone, benzophenone, carbonyl compounds, ketones investigation, amine organic metal compound; fillers such as silica powder; hardeners, such as an aromatic ester, acid anhydride, imidazole sigh class; solvent, such as ether esters class; defoamers and the like. The coating method is generally used serigraphy, and similar wet film.
Its role is as follows:
(1) preventing the physical disconnection of the conductor circuit;
(2) welding process, to prevent a short circuit due to bridging generated;
(3) must be welded only in part for welding, solder avoid waste;
(4) reduction of copper welding tank pollution;
(5) to prevent dust, moisture and other environmental factors cause insulation deterioration, corrosion;
(6) having a high insulation resistance, high-density circuit becomes possible.


1Layer:1 to 24 layers
2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3Board thickness:0.20mm to 3.4mm
4Copper thickness:0.5 OZ to 4 OZ
5Copper thickness in hole:>25.0 um (>1mil)
6Max. Board Size:(580mm×1200mm)
7Min. Drilled Hole Size:4mil(0.1mm)
8Min. Line Width:3mil (0.075mm)
9Min. Line Spacing:3mil (0.075mm)
10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
12Shape tolerance:±0.13
13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15Certificate:UL,SGS,ISO 9001:2008
16Special requirements:Buried and blind vias+controlled impedance +BGA
17Profiling:Punching, Routing, V-CUT, Beveling


• High Thermal Performance
 Tg: 180°C (DSC)
 Td: 340°C (TGA @ 5% wt loss)
 Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
 High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
 Closest to conventional FR-4 processing
• Core Material Standard Availability
 Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
 Available in full size sheet or panel form
• Prepreg Standard Availability
 Roll or panel form
 Tooling of prepreg panels available
• Copper Foil Type Availability
 Standard HTE Grade 3
 RTF (Reverse Treat Foil)
• Copper Weights
 ½, 1 and 2 oz (18, 35 and 70 μm) available
 Heavier copper available upon request
 Thinner copper foil available upon request
• Glass Fabric Availability
 Standard E-glass
 Square weave glass fabric available
 Spread glass fabric available
• Industry Approvals
 IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
 UL - File Number E41625 as PCL-FR-370HR
 Qualified to UL's MCIL Program

Rogers material in stock:

RogersRO40030.254 0.508,0.813,1.5243.38
RO43500.254 0.508,0.762,1.5243.5
RO60100.635MM, 1,27MM10.2

Q:Are you Factory or Trade company?

A:We are factory manufacturer,welcome to visit our factory.

Q:What kind of PCB file format can you accept for production?


Q:Can you accept copy board?

A:Yes,if you have pcb sample,can send to us,not only for PCB board,but also for PCBA,we can accept copy board

Q:How about your factory production capacity?

A:FR4:2000000Sqms High Frequency board:10000Sqms

Product Tags:

pcb manufacturing process


fr4 circuit board

Best Prototype Laser Drill pcb double sided In Calculator Application , HASL - LF Surface wholesale

Prototype Laser Drill pcb double sided In Calculator Application , HASL - LF Surface Images

Inquiry Cart 0
Send your message to this supplier
*To: Shenzhen Xinchenger Electronic Co.,Ltd
Characters Remaining: (0/3000)