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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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8 Layer Quick Turn PCB Board High Precision Multilayer Circuit Board Design Service

Shenzhen Xinchenger Electronic Co.,Ltd

8 Layer Quick Turn PCB Board High Precision Multilayer Circuit Board Design Service

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Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Layer of number : 8

Surface finish : Immersion gold

Base material : FR4

Size : 20*6cm

Board THK : 1.2mm

Product name : multilayer pcb

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8 Layer Multilayer PCB Board High Precision Circuit Fabricator

Specification:

Brand

XCE

Layer

8

Board THK

1.6mm

Model

XCEM

Surface finish

Immersion gold

Size

20*6cm

Copper THK

1OZ

Origin

China

Quick detail:

  • Base material: FR4
  • Color:Green solder mask,
  • Color:white silk screen
  • Packaging Details:Follow customer's spec.
  • Delivery Detail:within 7 days
  • Certificate:ISO9001, UL,ISO14001,SGS

Description:

Xinchenger Electronics co.,Ltd established in 2009,we have commited ourselves to manufacturing various

of hi-frequency microwave pcb and multi-layer board including fastest sample production.

we have accumulated abandunt experiences in the line of high frequency microwave business for

which widely apply to power divider,combiner,power amplifier,line amplifier,base station,RF antena,

4G antena so on and so forth.our company's sufficient stocks of hi-frequency pcb materials such as

Rogers,

TACONIC,Arlon,Isola,F4B,TP2,FR-4 (dielectric rage:2.2-16) mainly used in the area of high technologies

like communication device,Electronics,Aerospace,Military industry to meet our worldwide customers

with high quality.furthermore,we also keen on helping customers shorten the period of production

development and 24 hours of sample service is available.

Parameter:

Layer

2 to 28 layers

Material type

FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

Board thickness

1.6mm

Copper thickness

0.5 OZ to 7.0 OZ

Copper thickness in hole

>25.0 um (>1mil)

Size

- Max. Board Size: 23 × 25 (580mm×900mm)

- Min. Drilled Hole Size: 3mil (0.075mm)

- Min. Line Width: 3mil (0.075mm)

- Min. Line Spacing: 3mil (0.075mm)

Surface finishing

HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating

Tolerance

- Shape tolerance: ±0.13

- Hole tolerance: PTH: ±0.076

NPTH: ±0.05

Certificate

UL, ISO 9001, ISO 14001

Special requirements

Buried and blind vias+controlled impedance +BGA

Profiling

Punching, Routing, V-CUT, Beveling

Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased

products.

Advantage:

Sufficient rogers material raw,promopt response and delivery time.

Crossed blind vias is available

Application:

High technology field such as professional electronic equipment (computers, military equipment)

Aerospace communication and so on.


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